Terminal manufacturers continuously develop and research new technologies in order to increase their core competitiveness and adapt to market application needs. In the face of fierce competition in the terminal market, continuous improvement is essential to gain customer recognition.

At present, electronic products are becoming increasingly powerful and comprehensive, requiring higher and more diverse connectors. For example, the transmission rate of electronic devices is becoming higher and higher. In order to meet the transmission and exchange of large flow data, high-speed transmission and digital transmission requirements are put forward for connectors. However, in order to save device space and reduce device volume, it is necessary to integrate more and more signals such as microwave signals, optical signals, high-voltage signals, power signals, etc. into the same connector, and require independent transmission and non-interference between each signal. This determines that the development trend of connector signal transmission integration will become increasingly obvious.

The market's demand for centralized and miniaturized connectors has driven innovation in terminal technology. Semiconductor chip technology is becoming the driving force for the development of connectors in various levels of interconnections. For example, with the rapid development of 0.5mm pitch chip packaging towards 0.25mm pitch, the number of device pins in Level I interconnections (internal to IC devices) and Level II interconnections (interconnection between devices and boards) has increased from hundreds to thousands of lines. Compression fit contact technology is commonly used in cylindrical slotted sockets, elastic stranded wire pins, and hyperbolic spring socket connectors, greatly improving the reliability of the connectors and ensuring high fidelity of signal transmission.

Terminal technology enables connectors to form a new type of connector product, namely push-in connectors, which are mainly used for system level interconnection. Its biggest advantage is that there is no need for cables, installation and disassembly are simple, easy to replace on site, and the insertion speed is fast, the separation is smooth and stable, and good high-frequency characteristics can be obtained, suitable for spacecraft. The assembly technology of connectors is developing from plug-in installation technology to surface mount technology, and the future trend is towards micro assembly technology. The use of MEMS will be the driving force to improve connector technology and cost-effectiveness.